1. Single roll specifications: 2.0mm wide, 1.5m long; bulk packaging for repairs, meeting daily desoldering needs. 2. Ultra-high density woven copper mesh, excellent thermal conductivity, significantly improving desoldering efficiency. 3. Quickly removes excess solder, leaving pads clean and residue-free, effectively protecting PCB pads during chip replacement. 4. Anti-fragmentation design at the head prevents the desoldering tape from unraveling, facilitating alignment with tiny solder joints, suitable for precision micro-soldering on motherboards. 5. High-quality copper braided material, formulated with flux for smooth thermal conductivity. 6. For repairing mobile phone motherboards, PCB circuit boards, and IC chips.
