1. Perfectly compatible with 861DW and 861DS hot air desoldering stations, high compatibility. 2. Bent nozzle does not obstruct the view, suitable for fine-tuning repair work under a microscope. 3. Multiple nozzle diameters (4/5/6/8/10/12mm), small diameter nozzles provide concentrated and precise temperature, suitable for micro-components. 4. One-piece molded structure, direct plug-and-play installation, tight-sealed interface to prevent air leakage, stable and uniform hot air output. 5. High temperature resistant, smooth airflow channel, durable and not easily deformed, suitable for long-term motherboard repair use. 6. Suitable for desoldering and resoldering mobile phone motherboards, BGA chips, and integrated circuits.
